Samsung EMMC | |||||||
料号 | 版本 | 容量 | 工作电压 | 接口 | 封装尺寸 | 工作温度 | 生产状态 |
KLMCG2UCTB-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLMDG4UCTB-B041 | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | MassProduction |
KLM4G1FETE-B041 | eMMC5.1 | 4GB | 1.8,3.3V/3.3V | HS400 | 11x10x0.8mm | -25~85°C | MassProduction |
KLM8G1GEUF-B04P | eMMC5.1 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLM8G1GEUF-B04Q | eMMC5.1 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLMAG2GEUF-B04P | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLMAG2GEUF-B04Q | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLMBG4GEUF-B04P | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLMBG4GEUF-B04Q | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLMCG2KCTA-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLMCG2UCTA-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLMDG4UCTA-B041 | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | MassProduction |
KLMEG8UCTA-B041 | eMMC5.1 | 256GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | MassProduction |
KLM8G1GEME-B041 | eMMC5.1 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLM8G1GEND-B031 | eMMC5.0 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLM8G1GESD-B03P | eMMC5.0 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLM8G1GESD-B03Q | eMMC5.0 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLM8G1GESD-B04P | eMMC5.1 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLM8G1GESD-B04Q | eMMC5.1 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLM8G1GETF-B041 | eMMC5.1 | 8GB | 1.8,3.3V/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLM8G1WEPD-B031 | eMMC5.0 | 8GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMAG1JENB-B041 | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMAG1JETD-B041 | eMMC5.1 | 16GB | 1.8,3.3V/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLMAG2GEND-B031 | eMMC5.0 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMAG2GEND-B041 | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMAG2GESD-B03P | eMMC5.0 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLMAG2GESD-B03Q | eMMC5.0 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLMAG2GESD-B04P | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~85°C | MassProduction |
KLMAG2GESD-B04Q | eMMC5.1 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -40~105°C | MassProduction |
KLMAG2WEPD-B031 | eMMC5.0 | 16GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMBG2JENB-B041 | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMBG2JETD-B041 | eMMC5.1 | 32GB | 1.8,3.3V/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | MassProduction |
KLMBG4GEND-B031 | eMMC5.0 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMBG4GEND-B041 | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMBG4GESD-B03P | eMMC5.0 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~85°C | MassProduction |
KLMBG4GESD-B03Q | eMMC5.0 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~105°C | MassProduction |
KLMBG4GESD-B04P | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~85°C | MassProduction |
KLMBG4GESD-B04Q | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~85°C | MassProduction |
KLMBG4WEBD-B031 | eMMC5.0 | 32GB | 1.8/3.3V | HS400 | 11.5x13x0.8mm | -25~85°C | EOL |
KLMBG4WERD-B041 | eMMC5.1 | 32GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG2KETM-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG4JENB-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG4JETD-B041 | eMMC5.1 | 64GB | 1.8,3.3V/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | MassProduction |
KLMCG4JEUD-B04P | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.2mm | -40~85°C | Massproduction |
KLMCG4JEUD-B04Q | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.2mm | -40~105°C | Massproduction |
KLMCG4VERF-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG8GEND-B031 | eMMC5.0 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG8GEND-B041 | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMCG8GESD-B03P | eMMC5.0 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~85°C | MassProduction |
KLMCG8GESD-B03Q | eMMC5.0 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~105°C | MassProduction |
KLMCG8GESD-B04P | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~85°C | MassProduction |
KLMCG8GESD-B04Q | eMMC5.1 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -40~105°C | MassProduction |
KLMCG8WEBD-B031 | eMMC5.0 | 64GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMDG4UERM-B041 | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMDG8JENB-B041 | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.2mm | -25~85°C | EOL |
KLMDG8JEUD-B04P | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.2mm | -40~85°C | Massproduction |
KLMDG8JEUD-B04Q | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.2mm | -40~105°C | Massproduction |
KLMDG8VERF-B041 | eMMC5.1 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
KLMDGAWEBD-B031 | eMMC5.0 | 128GB | 1.8/3.3V | HS400 | 11.5x13x1.4mm | -25~85°C | EOL |
KLMEG8UERM-C041 | eMMC5.1 | 256GB | 1.8/3.3V | HS400 | 11.5x13x1.0mm | -25~85°C | EOL |
total 0 Sheet,Only 5 images can be uploaded, each less than 5m.